Semiconductor- Silicon wafer processing: shearing/grinding/polishing
Category: Smart Factory and Enterprise War Room
Exhibitor: BAOYI MOULD CO., LTD.
Booth No: N018
Characteristic
Silicon wafer processing
Thinning
Double-sided grinding
Mirror polishing
Other Products
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QNF Socket / Telon+ZrO2/ Packaging testing equipment parts
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Vacuum Chucks / Materials: CERMET/ Semiconductor equipment parts
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Vacuum Chucks / Aluminum alloy Polishing/ Semiconductor equipment parts
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Key components of ion implantation machines / Semiconductor equipment parts
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Clamps / Hastelloy/ Semiconductor equipment parts
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SiC Optical components / Semiconductor components
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Glue Needle / Materials: Tungsten steel / Stainless steel/ Packaging equipment parts
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QNF Socket / Black ZrO2 / Packaging testing equipment parts
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Aerospace parts/ Nickel-based alloys / Titanium alloys
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