At the 2026 Smart Manufacturing Expo, Power Micro will present its Precision 3D Jet Polishing and SP³ Diamond Coating technologies, specifically designed for semiconductor packaging molds and precision components. As semiconductor process nodes continue to shrink, even microscopic defects can lead to significant production losses. Through precise surface treatment control and micro-feature analysis, Power Micro provides predictable and optimized surface engineering solutions.

For molds with complex micro-geometries, 3D Jet Polishing achieves levels of surface uniformity and roughness control that are difficult to attain with conventional processes. Meanwhile, SP³ Diamond Coating, with its exceptional hardness and low coefficient of friction, effectively addresses wear resistance and adhesion challenges in semiconductor packaging processes.

These technologies not only extend the service life of molds and equipment components but also help maintain high chip packaging yields, demonstrating Power Micro’s expertise and leadership in materials science and precision engineering.